Imaging Method |
Dynamic Imaging |
Camera |
4 Mpix |
Imaging Resolution |
10 µm or 15 µm (factory setting) |
Lighting |
RGB LED |
3D Technology |
2-way Digital Fringe Pattern |
Field of View |
4 Mpix@ 10 µm: 20 x 20 mm |
Imaging Speed |
4 Mpix@ 10 µm: 90 cm²/sec |
Height Resolution |
0.4 µm |
Max. Solder Height |
@ 10 µm: 420 µm |
X-Axis Control |
Linear Motor and linear scale with DSP-based controller |
Y-Axis Control |
Ballscrew + AC-servo controller |
Z-Axis Control |
Ballscrew + AC-servo controller |
X-Y Axis Resolution |
0.5 µm |
Z-Axis Resolution |
1 µm |
Max PCB Size |
510 x 460 mm* |
PCB Thickness |
0.6-5 mm |
Max PCB Weight |
3 kg |
Top Clearance |
40 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
3 mm |
Conveyor Height |
880 – 920 mm |
WxDxH |
1220 x 1663 x 1620 |
Weight |
920 kg |
德律SPI锡膏检测机